| TPT |
TPT semi-automatic wire bonders Accelonix in partnership with TPT, is pleased to present a new generation of innovative manual, and semi-automatic wire and die bonders. These bonders provide a cost effective, high quality solution for bonding for lab use or small scale production. Semi-automatic features are a benefit for reliable quality and reproducible bond and loop formation. TPT, based in Munich Germany since 2000, has achieved rapid acceptance into worldwide market with a new generation of cost effective bonders with complete and innovative feature sets. Features include :
|
|||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Accelonix support for TPT products
Accelonix provides full technical support for all TPT products:- Field service
- Annual service contracts
- Application process support
- Training
- documentation
Demonstrations
Accelonix can make demonstrations and sample evaluations in our Evreux exhibition room. Demonstrations are also possible at client premises on request. Our technicians can support application testing and optimization, with advice on bonding parameters, and conditions for surfaces and applications.Beginner and expert user training is available from Accelonix.
Logistics
Delivery delay is typically 6 weeks, although shorter delivery is available on request.Installation is rapid, and normally organized at the same time training.
Accessories
All TPT products are proposed with a complete set of accessories.Related subjects
The TPT product range is complementary to our other products in the Micro-Assembly section (see link to Wirebonding category page). In particular Accelonix can also support:- Manual Pull and shear test
- Automatic wedge bonding
- Small batch plasma cleaning equipment
TPT Pull Tester
Overview of Technology
Manual and Semi-automatic fine wire bonder
For fine wire & ribbon- 17µ to 50µ Au & Al Wire
- 25µ x 200µ Au Ribbon
There are three families, for ball, wedge and ball/wedge bonders
Standard features
- Bond arm length 165 mm
- 90° Bonding Deep-access 16mm
- built-in dual fiber optic illuminator
- 6 : 1 ratio X-Y manipulator
- PLL Ultrasonic 62kHz generator
- built-in heater stage & tool heater controller
- Motorised wire clamp
Wide range of additional options
- Heating tool and work table
- Camera & external display
- Cross-hair & laser guide
Fine Wire Bonders
ManualHB02/HB04/HB05Standard bond arm length & vertical accessFully manual dial control of parameters Manual counter lever movement bond arm Brochure HB02 Wedge Bonder Brochure HB04 Ball Bonder |
|
Semi-automaticHB06/HB08/HB10Z-motor translation with touch down sensorTruely vertical bonding movementProgrammable loop height Motorized spool Calibrated force at different work heights Interface controlLCD Digital display for bonding parameters20 memory locations Selectable programme for stud-bump |
jj j
|
Programmable semi-automaticHB12/HB14/HB16In addition to the semi-automatic functions above…Y-motor translation for looping controlProgrammable loop profileProgrammable application specific bonding sequences Table tear tail termination 1 or 2 watt selector Interface control6,5" TFT Touch pannel interface100 memory Back up : USB Stick Brochure HB12 Wedge Bonder Brochure HB14 Ball Bonder |
|
HB30 Semi-autoSuitable for lab & small scale production for heavy wire bonding applications: 125µ to 500µ Aluminium wire |
|
Brochure HB30 |
Wire & Die bonder HB16DDeveloped from a HB16 wedgebonder, the HB16D provides a simple solution for die bonding for lab use or prototyping.One bondhead performs all bonding modes: ball/wedge; wedge/wedge bonding mode and die bonding. No hardware change is necessary. The features duplicate those of the HB16 with the addition of USB storage. |
 |
| Brochure HB16D |  |
Feature Comparison Table for Fine Wire Bonders
EconomyHB02
|
StandardHB06
|
PremiumHB12
|
| 17µ to 50µ Au & Al Wire |
17µ to 50µ Au & Al Wire & |
|
| 25µ x 200µ Au Ribbon |
||
| 90° Bonding Deep-access 16mm | ||
| Bond arm length 165 mm | ||
| built-in dual fiber optic illuminator | ||
| built-in heater stage & tool heater controller | ||
| 6 : 1 ratio X-Y manipulator | ||
| Motorised wire clamp | ||
| PLL Ultrasonic generator | PLL Ultrasonic 62kHz generator with 1 or 2 watt selector | |
| Stitch bonding capability | Stitch bonding & bump bonding capability | |
| electronic ball size control | ||
| 2" wire mechanical spooler | Motorised 2" wire spooler | |
| analog control pannel with independent control of first and second bond parameters | digital control with LCD display | 6,5" TFT Touch pannel control system |
| manual loopheight control | Semi-automatic & manual bonding modes | Semi-automatic, step & manual modes |
| programmable Loop Height |
programmable Loop-height & loop-shape |
|
| Motorised Z axes arm movement with 15mm travel |
||
| Motorised Y axes for step-back loop control 7mm travel |
||
| table tear of bondhead tear wire termination |
||
| capacity for storage of 20 bond settings with independent control of first and second bond parameters |
capacity for storage of 100 program |
|
| disc drive for file transfer | ||
