TPT - Technologie
Index de l'article
TPT
Technologie
Fine Wire Bonders
Heavy Wire Bonder
DieBonder
Feature Table
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Overview of Technology

Manual and Semi-automatic fine wire bonder

For fine wire & ribbon
  • 17µ to 50µ Au & Al Wire
  • 25µ x 200µ Au Ribbon

There are three families, for ball, wedge and ball/wedge bonders

Standard features

  • Bond arm length 165 mm
  • 90° Bonding Deep-access 16mm
  • built-in dual fiber optic illuminator
  • 6 : 1 ratio X-Y manipulator
  • PLL Ultrasonic 62kHz generator
  • built-in heater stage & tool heater controller
  • Motorised wire clamp

Wide range of additional options

  • Heating tool and work table
  • Camera & external display
  • Cross-hair & laser guide
 

Inspection Xpress
Le logiciel d'aide à l'inspection Visuelle

Inspection Xpress Version2.6.5  disponible dès maintenant.

Infos sur Inspection Xpress

picto-INX--ORIGINAL-3