The TPT manual and semi-automatic bonders are a new generation design, combining both ball and wedge with easy and rapid changeover solution.
Semi-automatic bond actions are permitted by bond parameter store, and motorised vertical bond head movement with integrated Z axis touch-down sensor.
An additional y-motorized movement, gives full loop control and multiple looping programming.
The machines are configured with long arm piezo and vertical deep (14mm) access tool configuration for ease of work with hybrids and circuits.

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