Hesse and Knipps has, since its introduction in 1997, achieved worldwide acceptance as the reference for automatic ultrasonic wedge-wedge bonding.

New generation of Fine and Heavy wire automatic bonders

The new generation bonders are operate on a small foot print chassis with active vibration minimization for bond stability.  Active bond force control and delay less touchdown detection contribute to extremely high speed and precise bonding with consistent bond quality performance.  Both versions have large bond area, giving flexibility for diverse automation solutions (COB, multiple indexing lines…)

BJ820 High Speed, Fine Pitch Wedge Bonder

• High speed - Up to 7 wires per second
• 1 μm at 3 σ axis repeatability
• Fine pitch capability: < 40 μm
• Largest Bonding Area 305 mm x 410 mm

BJ920 New Generation of Heavy Wire Bonders

• Active cutting bondhead - accurate programmable cutting depth
• Integrated, non-destructive shear- and/or pull-test
• High speed – up to 450 ms per wire
• Largest Bonding Area up to 380 mm x 500 mm (15" x 19.7")
• E-Box: patent-pending solution for optimized tool change and programmable alignment marks for guide, cutter and bond wedge

Pour plus d'information consultez la page Hesse & Knipps