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NEW 100% Bond quality monitoring
H&K have developed an industrialized method – referred to as PIQC –
for real time measurement and numerical analysis that generates
quality figure of merit proven to be in line with interofemetric
techniques. This solution is based on the H&K wirebonding
solution – exploiting the highly sensitive drive and control signals,
and adding dedicated sensors for the capture of the ultrasonic effects.
The solution has undergone pilot industrialization programs in 2006/7,
and was formerly launched November 2007.
Pour plus d'information consultez la page Hesse & Knipps
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Plasma process for improved band quality
In processes in which contamination is an issue, contaminant removal is
possible through a process of physical or chemical plasma cleaning.
Process gases are selected as a function of the type of contamination
(Ar for inorganic, and Oxygen for organique and Hydrogen for organic
contamination on oxidizing surfaces. Mixture of these materials with
Helium, Azote or Nitgrogen are also used.
The plasma effect and its efficiency to clean is adapted by the plasma
variables: gas density; RF power; RF frequency and plasma exposure
time. There will be a “sweet spot” in the optimization parameters
which achieve the best cleaning effectiveness which can only be found
be empirical techniques.
Pour plus d'information consultez la page March Plasma
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