Die attach
Die attach is the process in which a die is collected from its presentation state, placed in its destination with the correct orientation and positional precision, and the join between the die and its destination substrate layer is created.
The equipment solutions are as diverse – varying with physical process of the die attach: epoxy, eutectic, thermosonic bonding, ultrasonic bonding – and the operational configuration chose.
Pour plus d'informations, contactez-nous :
Par téléphone : 02 32 35 64 80
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Accelonix SAS - PA du long buisson
260, rue Clément Ader
27000 Evreux
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