| Ultrasonic flip chip die attach |
 Hesse & Knipps have derived from their technology leadership in wire bonding a solution for ultrasonic flip chip die bonding. The H&K FJ520 platform builds on the latest wire bonder platform, and combines wafer ejection, flipping process and die attach using the latest ultrasonic generation, precision and quality monitoring processes. Ultrasonic flip chip bonding permits mono-metallic connection, with very fine pitch - down to 20 μm. Cycle time per bond is low: about 1 to 2 seconds (without process time). The process does not require reflow processes. The H&K FJ520 platform is specified up to 100 N force, with +/- 5 μm positioning accuracy, and handling dies from 0.2 x 0.2 mm² up to 12 x 12 mm². The process exploits advances in quality methods from the wirebonding domain – particularly the H&K PIQC options, which monitor quality by combining functional analysis of bump deformation, chip adjustment parallel to substrate, bondforce control and bondforce profile. |