The MAT 6400 is cost effective, robust platform for high precision, automatic die attach, with moderate throughput.  The platform is a truely modular, and can be adapted to an extremely wide variety of physical processes and manufacturing process requirements.

The MAT 6400 is cost effective, robust platform for high precision, automatic die attach, with moderate throughput.  The platform is a truely modular, and can be adapted to an extremely wide variety of physical processes and manufacturing process requirements.
The MAT6400 platform inherits a long history of development and usage from the original platform 649X developed in 1990s, and improved in 2002 under the control of MAT by a highly experienced development team.  The adaptation and optimization of the MAT6400 platform is carried out by Accelonix engineering team, in collaboration with MAT and the customer process engineers.   Accelonix can guarantee support & maintenance to the customer.

 Processes possible with MAT6400

• Dispensing & die placement with 5µm accuracy
• Eutectic die attach
• thermosonic die attach
• Ulstrasonic attach
• Flipping processes
• Die stacking
• MEMs sensitive chip handling