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Void-free soldering without the use of flux for die attach and
assemblies using solder by combination of control of pressure and
atmospheric and temperature. The solution find application for power
semiconductor components where thermal dissipation is an important
consideration, and solder joint without voiding is critical for
component lifetime. The solution is also applied applications where
flux residue would interfere with the end application – for example
outgasing in vacuum filled hermetic packages, or for which flux
cleaning is not practical.
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SST are now recognized leaders in package assembly for design and
building precision vacuum/pressure furnaces for hi rel application,
with over 30 years experience in application development. The SST 3130
platform is purpose built to enable fine control of temperature, in a
chamber capable of 50mTorr vacuum and 50PSI overpressure to drive of
void in a single reflow process. Fine and accurate temperature control
is possible by isotropic heat generation through the graphite tooling
that houses components, ensuring repeatability and high batch yields.
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