Accelonix sealing processes

Benchmark FILLET.jpgAccelonix solutions for component packaging covers most aspects of hermetic packaging, including lid sealing processes & materials.  

For Chip-On-board applications we propose dispensing solutions as well as associated processes of wedgebonding and plasma for improved underfill & delamination effects.


optics_package.jpgHere is an overview of the main points of interest :

  1. Hermetic sealing
    • Seam-sealing
    • projection welding
    • atmospheric chambers
    • Solder joining
  2. High vacuum sealing
  3. Chip on board solutions
    • Low profile wirebonding on large area substrate
    • Plasma surface activation for improved underfill
  4. Hi Rel packaging Materials and getters
  5. Optical Leak Testing

 
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Davantis est la filiale d'Accelonix pour les services.

www.davantis.fr