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Seamsealing & Projection Welding

Seam sealing is an established solution for space & military & high reliability optical hermetic components.  A pulsed discharge welds the lid plating metallization, and a joint is formed to a metal seal ring on the package.    The sealing process is low temperature.

Projection welding is widely used for discrete transistor and oscillator packages.  A contact resistance is formed by an apex ridge on lid.  The metal to metal seal is formed around the complete circumference by a single discharge.  The heating effect is considerable, the weld pulse between 1000J up to 9000 Joules for very large packages.

Accelonix/Miyachi Unitek and the division Benchmark propose complete range of solutions for metal joining.  The Benchmark equipment maximize advantage from the high performance power supplies from Miyachi Unitek – to propose highly reliable sealing results.

Pour plus d'information consultez la page MIYACHI UNITEK

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Automatic environmental chamber (gloveboxes)

For the processes above, a controlled atmosphere is required to minimize humidity within the sealed packages.  Similarly vacuum bake-out processes are applied to all parts prior to assembly.

Accelonix/Miyachi Unitek can propose a complete range of manual and automatic environmental chambers.  Designs are modular in build up.  Different levels of automisation can assure an extremely high level of process security.

Pour plus d'information consultez la page MIYACHI UNITEK

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SST solutions for sealing by reflow

Reflow sealing is applied to glass metal seals, or lid sealing using solder alloy, for example for glass window and ceramic lids.  The process is also applicable to standard hermetic package sealing by combo lid with solder performs.   In this case the solder perform forms alloy joint with plated lid & metalisation on package.

Since over 25 year SST have manufactured solutions enabling excellent control of the processes variables (temperature, cycling and atmosphere) as well as and extended temperature range of 1000°C.  Heat is applied via precision graphite tooling – for maximum finesse of control and uniformity of heating.  A high forward  pressure during the reflow permits minimization of the voiding for guaranteed hermeticity.

Pour plus d'information consultez la page SST

 

Geotest

nouvelle carte PXI Flex DIO FPGA

La carte FPGA 3U PXI est configurable par l'utilisateur et comporte 160 entrées/sorties pour signaux numériques destinés aux besoins d'applications spécifiques. La nouvelle carte GX3500 utilise le circuit intégré programmable Altera Cyclone III, qui supporte des fréquences de base jusqu'à 150 MHz.

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