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H&K wirebonding for COB applications

High speed automatic wirebonding is with controlled low profile loop height for minimization of the overall dispensed glob top height.

The H&K maintain loop height irrespective of loop length.   Bonding over large area (410mm*305mm) is well suited to component bonding before pcb desegementation – permitting process handling improvements.  Wirebonding onto bare copper is also possible for material cost optimisation.

Pour plus d'information consultez la page Hesse & Knipps 

Plasma processes can be applied to improve wetting.  The effect is usefull for underfill applications, and in general reducing the risk of component failure due to delamination or underfill or glob top.

The plasma process creates a modification of molecular surface state, with the result of an higher binding energy to the molecules of the polymer applied.
Pour plus d'information consultez la page March Plasma

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