Page 1 de 6 TPT semi-automatic wire bonders Accelonix in partnership with TPT, is pleased to present a new generation of innovative manual, and semi-automatic wire and die bonders. These bonders provide a cost effective, high quality solution for bonding for lab use or small scale production. Semi-automatic features are a benefit for reliable quality and reproducible bond and loop formation. TPT, based in Munich Germany since 2000, has achieved rapid acceptance into worldwide market with a new generation of cost effective bonders with complete and innovative feature sets. Features include :
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Accelonix support for TPT products
Accelonix provides full technical support for all TPT products:- Field service
- Annual service contracts
- Application process support
- Training
- documentation
Demonstrations
Accelonix can make demonstrations and sample evaluations in our Evreux exhibition room. Demonstrations are also possible at client premises on request. Our technicians can support application testing and optimization, with advice on bonding parameters, and conditions for surfaces and applications.Beginner and expert user training is available from Accelonix.
Logistics
Delivery delay is typically 6 weeks, although shorter delivery is available on request.Installation is rapid, and normally organized at the same time training.
Accessories
All TPT products are proposed with a complete set of accessories.Related subjects
The TPT product range is complementary to our other products in the Micro-Assembly section (see link to Wirebonding category page). In particular Accelonix can also support:- Manual Pull and shear test
- Automatic wedge bonding
- Small batch plasma cleaning equipment
