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TPT semi-automatic wire bonders
Accelonix in partnership with TPT, is pleased to present a new generation of innovative manual, and semi-automatic wire and die bonders. These bonders provide a cost effective, high quality solution for bonding for lab use or small scale production. Semi-automatic features are a benefit for reliable quality and reproducible bond and loop formation.
TPT, based in Munich Germany since 2000, has achieved rapid acceptance into worldwide market with a new generation of cost effective bonders with complete and innovative feature sets.
Features include :
Accelonix support for TPT productsAccelonix provides full technical support for all TPT products:
DemonstrationsAccelonix can make demonstrations and sample evaluations in our Evreux exhibition room. Demonstrations are also possible at client premises on request. Our technicians can support application testing and optimization, with advice on bonding parameters, and conditions for surfaces and applications.
Beginner and expert user training is available from Accelonix.
LogisticsDelivery delay is typically 6 weeks, although shorter delivery is available on request.
Installation is rapid, and normally organized at the same time training.
AccessoriesAll TPT products are proposed with a complete set of accessories.
Related subjectsThe TPT product range is complementary to our other products in the Micro-Assembly section (see link to Wirebonding category page). In particular Accelonix can also support:
TPT Pull Tester