Page 1 de 4 Accelonix in partnership with Royce Instruments is pleased to present well engineered and fresh new designs for die sorting and pull test equipment.For over 23 years, Royce Instruments, Inc. has been an innovative global leader for design and manufacturing of precision assembly tools and high accuracy, low force bond testing equipment. Royce Instruments products include equipment for laser diode manufacturing, wire bond and die bond testing, semiconductor die pick and place into trays, waffle pack, and GelPak™ Feature include
Accelonix support for ROYCE INSTRUMENTS productsAccelonix provides full technical support for all Royce Instrument products:
Related subjectsThe ROYCE INSTRUMENTS product range is complementary to our other products in the Micro-Assembly section.In particular Accelonix can also support:
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Identification
Geotestnouvelle carte PXI Flex DIO FPGALa carte FPGA 3U PXI est configurable par l'utilisateur et comporte 160 entrées/sorties pour signaux numériques destinés aux besoins d'applications spécifiques. La nouvelle carte GX3500 utilise le circuit intégré programmable Altera Cyclone III, qui supporte des fréquences de base jusqu'à 150 MHz. |
Accelonix in partnership with Royce Instruments is pleased to present well engineered and fresh new designs for die sorting and pull test equipment.
