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Royce Instruments
650 Universal bond tester
MP300 Automatic die sorters
DE35-ST semi-auto die sorters
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Royce Logo.gifAccelonix in partnership with Royce Instruments is pleased to present well engineered and fresh new designs for die sorting and pull test equipment.


For over 23 years, Royce Instruments, Inc. has been an innovative global leader for design and manufacturing of precision assembly tools and high accuracy, low force bond testing equipment.

Royce Instruments products include equipment for laser diode manufacturing, wire bond and die bond testing, semiconductor die pick and place into trays, waffle pack, and GelPak™

Feature include

650 Universal pull/shear tester
– an attractive & usable equipment with all key functions and competitive price
New design, compact footprint, modular range
Very adaptable interface for specific users & applications.
  Royce Result.jpg
Automatic & semi-auto die sorters
from wafer to waffle pack, gel pack and film frame output
automatic handling  300mm > 2000 CPH
optional underside facet inspection ; Die flipping ; Non surface contact (NSC)

  Royce close up.jpg

Accelonix support for ROYCE INSTRUMENTS  products

Accelonix provides full technical support for all Royce Instrument  products:
  • Field service
  • Annual service contracts
  • Application process support
  • Training
  • documentation

Related subjects

The ROYCE INSTRUMENTS product range is complementary to our other products in the Micro-Assembly section.
In particular Accelonix can also support:
  • Wirebonding with PIQC quality control
  • Plasma cleaning
  • Die bonding & wafer handling


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