Formed in 1978, SST International is a recognized as a world leader in package assembly for semiconductor components for high reliability applications.
SST leadership is in the expertise & design and build vacuum/pressure furnaces for solder reflow processes; and in the understanding of the systems and processes that create void-free solder joints in a flux-free environment.
SST has a strong engineering culture, and participates actively with customers to customize the most ideal turnkey solutions for their microelectronic package assembly needs.

Starting principles

SST equipment combines two principles

• Heating chambers - with highly reliable & precise control of vacuum and high forward pressure
• Precision graphite tooling
  • acting as mechanical support for the component
  • generating an extremely uniform and  isotrophic heating element
  • permitting fine precision positioning of assembly element

Processes