Accelonix solutions address the processes following processed wafer creation.  Certain plasma processes are applicable, as are dicing, grinding, & sorting.
Accelonix can also propose solutions for substrate manufacture – for ceramic substrate, for de-segmentation and for cleaning.

Accelonix Highlights
1 Plasma for backend wafer handling processes
2 Wafer bonding
3 Semi-Auto or fully automatic die sorting
4 Substrate handling
 

Davantis est la filiale d'Accelonix pour les services.

www.davantis.fr