Certain back-end plasma processes are applied to fully processed wafers for functions such as contaminant removal, descum (following etch), wafer destress and surface activation. 
The plasma demands are lower than wafer lithography processes and the equipment proposed is different.

Accelonix works with March Plasma – in proposing cost effective low power plasma solutions.  Solutions are proposed either with automatic wafer handling, or adapted for manual handling in the laboratory.

 

Pour plus d'informations voir la page de March