Wafer bonding
 SST_WaferBonder.jpg  An innovation from SST International has generated a solution for glass/silicon or Si/Si bonding, adapted for wafer bonding of 150 mm wafers.  The solution is limited to mechanical alignment with temperatures up to 1000°C.

Precision graphite tooling maintains highly uniform mechanical pressure contact across wafer.  Options are available for high chamber pressure to minimize voiding or
high Vacuum for Anodic Bonding
Pour plus d'information voir la page SST
 

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