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An innovation from SST International has generated a solution for
glass/silicon or Si/Si bonding, adapted for wafer bonding of 150 mm
wafers. The solution is limited to mechanical alignment with
temperatures up to 1000°C.
Precision graphite tooling maintains
highly uniform mechanical pressure contact across wafer. Options are
available for high chamber pressure to minimize voiding or
high Vacuum for Anodic Bonding |
Pour plus d'information voir la page SST
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