Accelonix with Royce Instruments propose semi-automatic and die sorting equipment.
The semi-automatic machine executes with pick & place to waffle pack, gel pack and film frame output, and permits handling up to 200mm wafers, at < 1200UPH

A full automatic die sorting machine is adapated for 300mm wafers, with throughput greater than 2000UPH.  It has Window XP operating system supporting various wafer map readers, and flexible die binning & tray pocket level traceability.

Options for both machines include underside facet inspection,  die flipping, and non surface contact pick up.