Un substrat non compatible avec l’étain (Verre….)? Un pas de plus en plus fin: Fine pitch ? Un environnement non compatible avec l’utilisation des flux ? Le ThermoCollage, votre solution ACF (Fire Pitch) Heat Seal (Verre, LCD, Céramique) ACP

La technologie

An electro-mechanical connection is created between two components using anisotropic conductive adhesive. The adhesive is either pre-applied on standard, or customized heat-seal connectors, applied using screen printing or applied using a carrier film (ACF).

The conductive particles in the adhesive make contact in the Z- direction only when heat and pressure are applied.

A minimum contact time is required to ensure the adhesive cures properly.

Heat-sealing is mostly used to create flexible connections between components such as flexfoil to LCD and flexfoil to PCB.

UNICAM FX

Unicam FX Version 9.1 SP1 disponible dès maintenant.

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