|
- Un substrat non compatible avec l’étain (Verre….)?
- Un pas de plus en plus fin: Fine pitch ?
- Un environnement non compatible avec l’utilisation des flux ?
Le ThermoCollage, votre solution
- ACF (Fire Pitch)
- Heat Seal (Verre, LCD, Céramique)
- ACP
|
 |
La technologie
An electro-mechanical connection is created between two components using anisotropic conductive adhesive. The adhesive is either pre-applied on standard, or customized heat-seal connectors, applied using screen printing or applied using a carrier film (ACF).
The conductive particles in the adhesive make contact in the Z- direction only when heat and pressure are applied.
A minimum contact time is required to ensure the adhesive cures properly.
Heat-sealing is mostly used to create flexible connections between components such as flexfoil to LCD and flexfoil to PCB.
|