• Un substrat non compatible avec l’étain (Verre….)?
  • Un pas de plus en plus fin: Fine pitch ?
  • Un environnement non compatible avec l’utilisation des flux ?
Le ThermoCollage, votre solution
  • ACF (Fire Pitch)
  • Heat Seal (Verre, LCD, Céramique)
  • ACP
ThermoCollage

La technologie

ACFAn electro-mechanical connection is created between two components using anisotropic conductive adhesive. The adhesive is either pre-applied on standard, or customized heat-seal connectors, applied using screen printing or applied using a carrier film (ACF).

The conductive particles in the adhesive make contact in the Z- direction only when heat and pressure are applied.

A minimum contact time is required to ensure the adhesive cures properly.

Heat-sealing is mostly used to create flexible connections between components such as flexfoil to LCD and flexfoil to PCB.

 

Davantis est la filiale d'Accelonix pour les services.

www.davantis.fr