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HESSE MECHATRONICS - BJ830 Fully Automatic Area Ball-Wedge Bonder

The Bondjet BJ830 is a fully automated, thermosonic fine wire ballwedge bonder with a large working area. The BJ830 is designed for wire bonding challenges on a single platform. Typical applications are components in the HF and RF technology, COB, MCM and hybrids, opto and automotive electronics. The BJ830 defines the latest state of technological development compared to the competition.

BJ830

• large area work table 410*305mm
• deep access 12mm tool with multi-level bonding according to Z axis stroke of 31 mm (1.22″)
• Precise bondforce control (static and dynamic) 10 cN - 300 cN programmable
• Loop generator for customized loops
• automatic force calibration
• Windows operating system
• E-Box: graphical ball inspection
• Manual and fully automated operation
• bond quality traceability
• SECS/GEM connection and MES interface
• PR cockpit for remote control for PR resolution

BJ830 NEFO