HESSE MECHATRONICS - BJ830 Fully Automatic Area Ball-Wedge Bonder
The Bondjet BJ830 is a fully automated, thermosonic fine wire ballwedge bonder with a large working area. The BJ830 is designed for wire bonding challenges on a single platform. Typical applications are components in the HF and RF technology, COB, MCM and hybrids, opto and automotive electronics. The BJ830 defines the latest state of technological development compared to the competition.
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• large area work table 410*305mm |