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ADT - ADT7200 fully automatic wafer handling

2’’ and 4’’ spindle dicing systems
200mm and 300mm wafer
Chargement/déchargement des cassettes

adt7200

•  Integrated coating/decoating & UV curing
•  Bar code reader
•  SECS-GEM communication
•  Hardware Platform designed for high reliability with minimum maintenance requirement
•  Heavy Duty, Cast-iron Base Structure
•  2’’ and 4’’ spindle dicing systems
•  200mm and 300mm wafer
•  Front-mounted spindle 1.2kW or 2.5kW spindle
•  Windows with Touch panel MMI interface
•  Options : dress station, broken blade detection